半导体靶材

高纯钨靶

产品介绍


产品用途:

用作金属层间的通孔(Vias)和垂直接触的接触孔(Contact)的填充物,即钨塞(W Plug)。

Application:

It is used as a filler for through holes (Vias) between metal layers and vertical contact holes (contact), i.e. tungsten plug.

 

产品性能参数/Product Property Parameters:

化学成分

Chemical Compositions

主含量,(%,不小于)

Main Content, %, min

W

99.99

99.999

 

 

 

 

 

 

 

 

 

 

 

 

 

杂质含量

(质量分数),

%,不大于)

Impurity Content (mass fraction), %, max

Al

0.0001

0.0001

B

-

0.00001

Bi

0.0001

0.00001

Ca

0.0005

0.00005

Co

0.0001

0.00005

Cr

0.0002

0.0001

Cu

0.0002

0.0001

F

-

0.00001

Fe

0.0010

0.0001

K

0.0001

0.00001

Li

-

0.00005

Mg

0.0001

-

Mn

0.00005

0.00005

Mo

0.0010

-

Na

0.0002

0.00001

Ni

0.0002

0.0001

Pb

0.0003

0.00001

Si

0.0010

0.00005

Sn

0.0001

0.0001

Th

-

0.00000005

Ti

0.00005

0.00005

U

-

0.00000005

Zr

0.00005

-

Zn

0.0001

0.00005

C

0.0050

0.0050

O

0.0100

0.0100

S

0.0010

0.0010

 

注:钨含量为100%减去表中所列杂质元素实测含量的总和(不包含气体元素);需方如有特殊要求时,由供需双方协商确定,并在合同或订货单中注明。

Note: Molybdenum content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

 

其他性能Others:

相对密度

Relative Density

平均晶粒尺寸

Average Grain Size

(μm)

粗糙度

Roughness

(Ra, μm)

平面度

Flatness

mm

99%

100

0.8

1%

 

尺寸Size:

形状

Shape

厚度

Thicknessmm

宽度

Widthmm

长度

Lengthmm

直径

Diametermm

圆形Round

3-25

-

-

450

方形Square

3-25

600

2000

-

 

 

注:如有特殊要求,双方具体商定。

Note: Special requirements will be agreed upon by the supplier and buyer.


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