产品用途：
3D模具用钨均温板。
Application:
It is used for 3D Die Moulds.
主要成份和性能参数 Main Element and Property Parameters:
|
主含量Main Content
|
热导率Thermal conductivity
(W·m−1·K−1)
|
膨胀系数Coefficient of Expansion
(µm·m−1·K−1)
|
弹性模量Modulus of Elasticity
(GPa)
|
密度Density
(g·cm−3)
|
硬度Hardness（HV10）
|
粗糙度Roughness
|
|
W:
≥99.95%
|
~173
|
~ 4.5
|
~ 410
|
≥19.1
|
400~460
|
0.2~0.8
|
纯钨均温板的优势
Advantages of Pure Tungsten Temperature Equalizing Plate：
导热快，均温性好，均温速度快；
Fast heat conduction, good temperature uniformity and fast temperature equalization speed;
高温强度好，膨胀系数小，高温不变形；
Good high temperature strength, small expansion coefficient and no deformation at high temperature;
使用寿命长，长期使用不起皮、不开裂；
Long service life, no peeling and cracking after long-term use;
刚性好，热弯产品精度高，良品率高。
Good rigidity, high precision and high yield of hot bending products
