产品用途：
应用于高温环境中的触摸屏面板（TSP）和结构组件。
Application:
They are mainly used in touch screen panels (TSPs) and structural assemblies in high temperature environments.
产品性能参数/Product Property Parameters:
其他性能Other Properties:
|
牌号 Grade |
密度 Density (g/cm3) |
平均晶粒尺寸Average Grain Size (μm) |
粗糙度Roughness (μm) |
直线度Straightness (mm) |
贴合率Bonding Rate |
|
MoNb5 |
≥10.00 |
≤100 |
≤0.8 |
≤0.30 |
≥97% |
|
MoNb10 |
≥9.90 |
≤100 |
≤0.8 |
≤0.30 |
≥97% |
注：如有特殊要求，双方具体商定。
Note: Special requirements will be agreed upon by the supplier and buyer.
