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  • Tungsten-titianium Target
  • Tungsten-titianium Target

Tungsten-titianium Target

As a special electronic material with high added values, semiconductor targets are mainly used in microelectronics, display, memory, optical coating and other industries to sputter various thin film materials for cutting-edge technology.

Product Description


产品用途:

用作扩散阻挡层,阻止铝或铜在硅中的扩散,同时对与其接触的材料有粘附作用。

Application:

It is used as a diffusion barrier to prevent the diffusion of Al or Cu in Si, and has adhesion to the materials in contact with it.


产品性能参数/Product Property Parameters:

化学成分

Chemical Compositions

主含量,(%

Main Content, %

W

89.45~90.45

Ti

10±0.5

 

 

 

 

 

 

杂质含量

(质量分数),

%,不大于)

Impurity Content (mass fraction), %, max

Fe

0.0030

Al

0.0020

Si

0.0010

Mg

0.0010

Ni

0.0010

Ca

0.0020

Cu

0.0010

Pb

0.0010

Bi

0.0010

Sn

0.0010

Sb

0.0010

As

0.0010

Mo

0.0060

P

0.0020

C

0.0020

N

0.0020

O

0.0020

注:钼含量为100%减去表中所列杂质元素实测含量的总和(不包含气体元素);需方如有特殊要求时,由供需双方协商确定,并在合同或订货单中注明。

Note: Molybdenum content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

 

其他性能Others:

相对密度

Relative Density

平均晶粒尺寸

Average Grain Size

(μm)

粗糙度

Roughness

(Ra, μm)

平面度

Flatness

mm

98%

100

0.8

1%

 

尺寸Size:

形状

Shape

厚度

Thicknessmm

宽度

Widthmm

长度

Lengthmm

直径

Diametermm

圆形Round

3-25

-

-

450

 

 

注:如有特殊要求,双方具体商定。

Note: Special requirements will be agreed upon by the supplier and buyer.


Telephone

0731-88056699

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