Tungsten-titianium Target

As a special electronic material with high added values, semiconductor targets are mainly used in microelectronics, display, memory, optical coating and other industries to sputter various thin film materials for cutting-edge technology.

Product Description

产品用途：

用作扩散阻挡层，阻止铝或铜在硅中的扩散，同时对与其接触的材料有粘附作用。

Application:

It is used as a diffusion barrier to prevent the diffusion of Al or Cu in Si, and has adhesion to the materials in contact with it.

产品性能参数/Product Property Parameters：

化学成分 Chemical Compositions
主含量，（%） Main Content, %	W	89.45~90.45
主含量，（%） Main Content, %	Ti	10±0.5
杂质含量（质量分数），（%，不大于） Impurity Content (mass fraction), %, max	Fe	0.0030
	Al	0.0020
	Si	0.0010
	Mg	0.0010
	Ni	0.0010
	Ca	0.0020
	Cu	0.0010
	Pb	0.0010
	Bi	0.0010
	Sn	0.0010
	Sb	0.0010
	As	0.0010
	Mo	0.0060
	P	0.0020
	C	0.0020
	N	0.0020
	O	0.0020
注：钼含量为100%减去表中所列杂质元素实测含量的总和（不包含气体元素）；需方如有特殊要求时，由供需双方协商确定，并在合同或订货单中注明。 Note: Molybdenum content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

其他性能Others:

相对密度

Relative Density

平均晶粒尺寸

Average Grain Size

(μm)

粗糙度

Roughness

(Ra, μm)

平面度

Flatness

（mm）

≥98%

≤100

≤0.8

≤1%

尺寸Size:

形状

Shape

厚度

Thickness（mm）

宽度

Width（mm）

长度

Length（mm）

直径

Diameter（mm）

圆形Round

3-25

≤450

注：如有特殊要求，双方具体商定。

Note: Special requirements will be agreed upon by the supplier and buyer.

High-purity Tungsten Target

no data

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