Finish Machined parts

Tungsten Temperature Equalizing Plate

product description


产品用途:

3D模具用钨均温板。

Application:

It is used for 3D Die Moulds.

 

主要成份和性能参数 Main Element and Property Parameters:

主含量Main Content

热导率Thermal conductivity

(W·m−1·K−1)

膨胀系数Coefficient of Expansion

(µm·m−1·K−1)

弹性模量Modulus of  Elasticity

(GPa)

密度Density

(g·cm−3)

硬度HardnessHV10

粗糙度Roughness

W:

99.95%

~173

~ 4.5

~ 410

19.1

400~460

0.2~0.8

 

纯钨均温板的优势

Advantages of Pure Tungsten Temperature Equalizing Plate

导热快,均温性好,均温速度快;

Fast heat conduction, good temperature uniformity and fast temperature equalization speed;

高温强度好,膨胀系数小,高温不变形;

Good high temperature strength, small expansion coefficient and no deformation at high temperature;

使用寿命长,长期使用不起皮、不开裂;

Long service life, no peeling and cracking after long-term use;

刚性好,热弯产品精度高,良品率高。

Good rigidity, high precision and high yield of hot bending products 


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